For SMT chip processing, solder joint voids are a serious quality problem. The presence of voids will increase the oxidation of the product, which will lead to the deepening of the aging reaction of the product in advance. So, how do the hollows in SMT
turnkey PCB assembly chip processing occur?
1. The cause of solder paste. The alloy composition of the solder paste is different, and the size of the particles is different, which will cause bubbles during the solder paste printing process, and some air will continue to remain during reflow soldering, and voids will be generated after the bubbles burst at high temperatures.
2, PCB pad surface treatment method. The surface treatment of the pad also has a crucial effect on the generation of voids.
3. Reflux curve setting. If the reflow soldering temperature rises too slowly or cools down too fast, the residual air inside cannot be effectively eliminated, resulting in voids.
4. Reflow environment. Whether the equipment is vacuum reflow soldering also affects the generation of voids.
5. Pad design. The unreasonable pad
pcb manufacturing design is also a very important reason for voids.
6, micro-holes. This is one of the most easily overlooked points. If the micro-holes are not reserved or the positions of the micro-holes are incorrect, voids may occur.
